ASML introduces a new generation of high NA EUV lithography machine: chip shrinkage by 1.7 times, density increased by 2.9 times

According to industry predictions, semiconductors will enter the angstrom scale (Å, angstrom, 1 angstrom = 0.1 nanometer) at the scale of 2025, of which 2025 corresponds to A14 (14 Å = 1.4 nanometers).

In addition to the new transistor structure and 2D materials, there is also a very critical part of the High NA (High Numerical Aperture) EUV lithography machine. According to the latest information disclosed by ASML, the first prototype trial machine will be opened in 2023 and is expected to be installed by imec (Belgian Research Center for Microelectronics). After 2025, mass production is expected. The first is expected to be delivered to Intel.

Gartner analyst Alan Priestley said that the unit price of the 0.55NA next-generation EUV lithography machine will double to 300 million US dollars.

So what can such an expensive machine achieve?

ASML spokesperson introduced to the media,Higher lithography resolution will allow the chip to shrink by 1.7 times while increasing the density by 2.9 times. In the future, processes more advanced than 3nm will rely heavily on high NA EUV lithography machines.

Of course, ASML cannot independently produce high NA EUV lithography machines. It also needs the support of important manufacturers such as German Zeiss and Japanese photoresist coating.

The 0.33NA EUV lithography machine currently sold by ASML has more than 100,000 parts and requires 40 shipping containers or 4 jet cargo planes to complete the one-time transportation. The unit price is about 140 million US dollars.

ASML only sold 31 EUV lithography machines last year, and this year the number has increased to over 100.


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